Underfill is a material suitable for flip-chip circuits. It fills the gap between the IC chip and the organic substrate, and seals and protects the connection solder joints, reducing the thermal expansion coefficient mismatch between the silicon chip and the organic substrate. , protects the device from moisture, ionic contaminants, radiation, and harmful operating environments such as mechanical stretching, shearing, twisting, vibration, etc.
This report contains market size and forecasts of Chip Level Underfill in global, including the following market information:
Global Chip Level Underfill Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Chip Level Underfill Market Sales, 2017-2022, 2023-2028, (Tons)
Global top five Chip Level Underfill companies in 2021 (%)
The global Chip Level Underfill market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fluid Filler Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Chip Level Underfill include LORD, Henkel, United Adhesives, Namics, Hitachi Chemical, WON CHEMICAL, SUNSTAR, Zymet and Shin-Etsu Chemical, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Chip Level Underfill manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip Level Underfill Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Chip Level Underfill Market Segment Percentages, by Type, 2021 (%)
Fluid Filler
Non Flowing Filler
Global Chip Level Underfill Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Chip Level Underfill Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Vehicle Electronics
Internet of Things
Others
Global Chip Level Underfill Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Chip Level Underfill Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip Level Underfill revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Chip Level Underfill revenues share in global market, 2021 (%)
Key companies Chip Level Underfill sales in global market, 2017-2022 (Estimated), (Tons)
Key companies Chip Level Underfill sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
LORD
Henkel
United Adhesives
Namics
Hitachi Chemical
WON CHEMICAL
SUNSTAR
Zymet
Shin-Etsu Chemical
FUJI
Master Bond
Darbond Technology
Dongguan Tiannuo New Material Technology
Hanstars