ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.
This report contains market size and forecasts of Die-level Packaging Equipment in global, including the following market information:
Global Die-level Packaging Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Die-level Packaging Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Die-level Packaging Equipment companies in 2021 (%)
The global Die-level Packaging Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Automatic Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Die-level Packaging Equipment include ASM International, BeSemiconductor Industries, DISCO, Kulicke & Soffa Industries, Advantest, Cohu, Hitachi High-Technologies, Shinkawa and TOWA Corporation. etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Die-level Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Die-level Packaging Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die-level Packaging Equipment Market Segment Percentages, by Type, 2021 (%)
Automatic
Semi-automatic
Global Die-level Packaging Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die-level Packaging Equipment Market Segment Percentages, by Application, 2021 (%)
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other
Global Die-level Packaging Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die-level Packaging Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Die-level Packaging Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Die-level Packaging Equipment revenues share in global market, 2021 (%)
Key companies Die-level Packaging Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies Die-level Packaging Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASM International
BeSemiconductor Industries
DISCO
Kulicke & Soffa Industries
Advantest
Cohu
Hitachi High-Technologies
Shinkawa
TOWA Corporation