As the global economy mends, the 2021 growth of Electromagnetic Shielding Copper Foil Tape will have significant change from previous year. According to our (LP Information) latest study, the global Electromagnetic Shielding Copper Foil Tape market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Electromagnetic Shielding Copper Foil Tape market size will reach USD million in 2028, growing at a CAGR of % over the analysis period 2022-2028.
The United States Electromagnetic Shielding Copper Foil Tape market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global Electromagnetic Shielding Copper Foil Tape market, reaching US$ million by the year 2028. As for the Europe Electromagnetic Shielding Copper Foil Tape landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.
Global main Electromagnetic Shielding Copper Foil Tape players cover Laird, Parker Hannifin Corporation Engineered Materials Group, Teraoka, and PPI, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Electromagnetic Shielding Copper Foil Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Single-sided Tape
Double-sided Tape
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Consumer Electronics
Communications Industry
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Laird
Parker Hannifin Corporation Engineered Materials Group
Teraoka
PPI
DuPont
PLEO
3M
Ampetronic
TESA
Nitto
Mitsui Mining and Smelting
Furukawa Electric
Holland Shielding Systems
Nuode Investment
Shenzhen Born Electronic Materials
Chongqing Hongfucheng Electronic New Material
Shenzhen Frd Science&technology
CONLIDA
Shenzhen Jinwang Adhesive Products