As the global economy mends, the 2021 growth of Multi-layer PCBs will have significant change from previous year. According to our (LP Information) latest study, the global Multi-layer PCBs market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Multi-layer PCBs market size will reach USD million in 2028, growing at a CAGR of % over the analysis period 2022-2028.
The United States Multi-layer PCBs market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global Multi-layer PCBs market, reaching US$ million by the year 2028. As for the Europe Multi-layer PCBs landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.
Global main Multi-layer PCBs players cover Nippon Mektron, ZD Tech, TTM Technologies, and Unimicron, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Multi-layer PCBs market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Layer 4-6
Layer 8-10
Layer Above 10
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Other
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington
Kinwong
Founder Tech
Dynamic
Aoshikang
Wuzhou
CCTC
SZ Fast Print
Guangdong Xinda
Shenzhen Suntak
Redboard
DG Shengyi Elec
Olympic