Global Medical Grade Adhesive Market
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As the global economy mends, the 2021 growth of Underfills for Semiconductor will have significant change from previous year. According to our (LP Information) latest study, the global Underfills for Semiconductor market size is USD million in 2022 from USD 527.6 million in 2021, with a change of % between 2021 and 2022. The global Underfills for Semiconductor market size will reach USD 970.5 million in 2028, growing at a CAGR of 9.1% over the analysis period 2022-2028.
The United States Underfills for Semiconductor market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global Underfills for Semiconductor market, reaching US$ million by the year 2028. As for the Europe Underfills for Semiconductor landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.
Global main Underfills for Semiconductor players cover Henkel, Won Chemical, NAMICS, and Showa Denko, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfills for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Chip-on-film Underfills
Flip Chip Underfills
CSP/BGA Board Level Underfills
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Henkel
Won Chemical
NAMICS
Showa Denko
Panasonic
MacDermid (Alpha Advanced Materials)
Shin-Etsu
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Hanstars
Nagase ChemteX
LORD Corporation
Asec Co., Ltd.
Everwide Chemical
Bondline
Panacol-Elosol
United Adhesives
U-Bond
Shenzhen Cooteck Electronic Material Technology
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